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IC FPGA 356 I/O 456BGA
HEATSINK (80)115.6X89X12MM LOPRO
PAD THERMAL SIZE80 FOR AMPSS MOD
SOCKET SPRING(20-CONTROL/15-PWR)
STUD MTG SOLDER FOR HEATSINK
STUD MTG TAPPED FOR HEATSINK
PAD THERMAL SIZE60 FOR AMPSS MOD
STUD MTG SOLDER FOR HEATSINK LP
OPTOISOLTR 5KV TRANSISTOR 4-SOP
OPTOISOLTR 5KV TRANSISTOR 6-DIP
OPTOISOLTR 5KV TRANSISTOR 4-SMD
OPTOISO 5KV TRANS W/BASE 6DIP
OPTOISO 1.5KV TRANS W/BASE 6SMD
OPTOISO 3.75KV TRANS W/BASE 8DIP
OPTOISO 5KV TRANS W/BASE 5SOP