| 類型: | DIP, 0.3" (7.62mm) Row Spacing |
|---|---|
| 終止郵政長度: | 0.125" (3.18mm) |
| 終止: | Solder |
| 系列: | Lo-PRO®file, 513 |
| 瀝青 - 郵政: | 0.100" (2.54mm) |
| 間距 - 配合: | 0.100" (2.54mm) |
| 封装: | Bulk |
| 工作溫度: | - |
| 位置或引腳數目（柵極）: | 30 (2 x 15) |
| 安裝類型: | Through Hole |
| 材料可燃性額定值: | UL94 V-0 |
| 外殼材料: | Polyamide (PA46), Nylon 4/6, Glass Filled |
| 特徵: | Closed Frame |
| 目前評級: | 3A |
| 接觸電阻: | - |
| 聯繫材料 - 郵政: | Brass |
| 觸點材料 - 接合: | Beryllium Copper |
| 觸點塗層厚度 - 柱: | 200µin (5.08µm) |
| 觸點鍍層厚度 - 配合: | 10µin (0.25µm) |
| 聯繫我們: | Tin |
| 接觸完成 - 接合: | Gold |
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CONN IC DIP SOCKET 30POS GOLD
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